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Semiconductor Assembly Testing Service

SAT 1-stop Turnkey Service


Little Quantity Assembly and Test Demand
APT can help you 

 

APT's SAT Service

  • Wafer grinding, thinning and polishing
  • Wafer sawing & dicing (full wafer, individual dies and MPW wafer)
  • Die plating, pick & place
  • Die attach
  • Wire bond (aluminum, gold, multi-tier)
  • Flip-chip package
  • Substrate solder ball attach
  • Packaging in tube, T&R and trays
  • Exclusive leadframe package
  • Exclusive pin-out define
  • Special PiP, PoP and 3D-stack package
If you have any special SAT demand,  Find us APT



 
Little Quantity Assembly and Test Demand
APT can help you 

 


↓I have SAT demand↓

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