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客製化封測—一站式服務

Customize SAT 1-stop Turnkey Service

亞德對SAT(Semiconductor Assembly Test,半導體封測)的Turnkey完整方案服務範圍,包含以下的項目,其中不乏歐美客戶的特殊專屬封裝、特規腳位和球腳陣列,但礙於保密義務尚不便揭露;若您欲尋求的項目不在其中,也請您別錯過機會,亞德的半導體封測夥伴和資源,橫跨歐亞俄,都是長年且經常性的國際知名大廠,期盼您來洽談:

  • Wafer grinding, thinning and polishing
  • Wafer sawing & dicing (full wafer, individual dies and MPW wafer)
  • Die plating, pick & place
  • Die attach
  • Wire bond (aluminum, gold, multi-tier)
  • Flip-chip package
  • Substrate solder ball attach
  • Packaging in tube, T&R and trays
  • Exclusive leadframe package
  • Exclusive pin-out define
  • Special PiP, PoP and 3D-stack package
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